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        當前位置:主頁 > 產品中心 > 主控芯片

        RK3399

        RK3399 is a low power, high performance processor for computing, personal mobile internet devices and other smart device applications.
        型號:RK3399
        品牌:ROCKCHIP
        封裝:FCBGA828
        批號:17+
        庫存:600

        規格書(Datesheet):RK3399.PDF 點擊下載

        商品信息

         

              RK3399 is a low power, high performance processor for computing, personal mobile internet  devices and other smart device applications. Based on Big.Little architecture, it integrates dual-core Cortex-A72and quad-core Cortex-A53 with separate NEON coprocessor.(點擊即可咨詢芯片詳細信息
         
        RK3399’s Features
        1、 Microprocessor
        l - Dual-core ARM Cortex-A72 MPCore processor and Quad-core ARM Cortex-A53 MPCore
        processor, both are high-performance, low-power and cached application processor
        l - Two CPU clusters. Big cluster with dual-core Cortex-A72 is optimized for high-performance and little cluster with quad-core Cortex-A53 is optimized for low power.
        l - Full implementation of the ARM architecture v8-A instruction set, ARM Neon Advanced
        SIMD (single instruction, multiple data) support for accelerating media and signal processing
        l - ARMv8 Cryptography Extensions.
        l - SCU ensures memory coherency between the MPCore for each cluster.
        l - TCCI500 ensures the memory coherency between the two clusters
        - Each Cortex-A72 integrates 48KB L1 instruction cache and 32KB L1 data cache with 4-way set associative. Each Cortex A53 integrates 32KB L1 instruction cache and 32kB L1 data cache separately with 4-way set associative
        l - 1MB unified L2 Cache for Big cluster, 512KB unified L2 Cache for Little cluster.
        l - Trustzone technology support
        - Full Coresight debug solution
        l - Eight separate power domains for CPU core system to support internal power switch and externally turn on/off based on different application scenario
         
        2、Memory Organization
        l - Internal on-chip memory
        l - External off-chip memory
        3、 Internal Memory
        l - Internal BootRom
        l - Internal SRAM
        4、External Memory or Storage device
        l - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
        from various vendor
        l - eMMC Interface
        l - SD/MMC Interface
        5、System Component
        l - Cortex-M0
        - CRU (clock & reset unit)
        l - PMU
        l - Timer
        - PWM
        l - WatchDog
        - MailBox
        l - Bus Architecture
        l - Interrupt Controller
        l - DMAC
        l - Security system
        6、Video CODEC
        l - Embedded memory management unit(MMU)
        l - Video Decoder
        l - Video Encoder
        7、 JPEG CODEC
        l - JPEG decoder
        8、Image Enhancement (IEP module)
        l - Image pre-processor
        l - Video stabilization
        l - Image Post-Processor(embedded inside video decoder)
        - Image Enhancement-Processor (IEP)
        9、 Graphics Engine
        -3D Graphics Engine
        -2D Graphics Enginel-
        10、 Video IN/OUT
        l - Camera Interface
        - Image Signal Processer
        - Display Interface
        - Video Output Processor(VOP_BIG)
        - Write back
        - Embedded memory management unit(MMU)
        11、 HDMI
        - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
        - Link controller flexible interface with 30-, 60- or 120-bit SDR data access
        - Support HDCP 1.4/2.2
        12、MIPI PHY
        -Embedded 3 MIPI PHY, MIPI0 only for DSI, MIPI1 for DSI or CSI, MIPI2 only for CSI
        -Lane operation ranging from 80 Mbps to 1.5 Gbps in forward direction
        -Each port have 4 data lane, providing up to 6.0 Gbps data rate
        -Support 1080p@60fps output with single channel
        -Support 2560x1600@60fps output with MIPI0 and MIPI1 dual channel
        13、eDP PHY
        -Compliant with eDPTM Specification, version 1.3
        -Support RGB 6/8/10bit video format
        -Up to 4 physical lanes of 2.7/1.62 Gbps/lane
        -Support VESA DMT and CVT timing standards
        -Fully support EIA/CEA-861Dvideo timing and Info Frame structure
        -Hot plug and unplug detection and link status monitor
        -Supports Panel Self Refresh(PSR)
        14、DisplayPort
        -Compliant with DisplayPort Specification, version 1.2
        -Compliant with HDCP2.2 (and back compatible with HDCP1.3)
        -There is only one DisplayPort controller built-in RK3399 which is shared by 2 Type-C
        interface
        -25-600Mhz pixel clock
        -Supports 8/10 bpp RGB,YCbCr422,YCbCr420formats
        -Supports up to 4kx2k at 60Hz resolution
        -Variety of audio formatsPCM and compressed, over I2S or SPDIF interfaces
        -1Mbps AUX channel
        15、TYPE-C Interface
        - Embedded 2 Type-C PHY
        - Compliant with USB Type-C Specification, revision 1.1
        - Compliant with USB Power Delivery Specification, revision 2.0
        - Attach/detach detection and signaling as DFP, UFP and DRP
        - Plug orientation/cable twist detection
        - Enable/disable VBUS as DFP and DRP(when operating as DFP)
        - VBUS detection as UFP and DRP(when operating as UFP)
        - USB Power Delivery communication across the CC wire
        - Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode on USB Type-C. Two PMA TX-only
        lanes and two PMA half-duplex TX/RX lanes(can be configured as TX-only or RX-only)
        - Up to 5Gbps data rate for USB3.0
        - Up to 5.4Gbps(HBR2) data rate for DP1.2, can support 1/2/4 lane mode
        - Support DisplayPort AUX channel
         
        16、 Audio Interface
        l - I2S0/I2S1 with 8ch
        l - I2S2/PCM with 2ch
        l - SPDIF
        17、 Connectivity
        l - SDIO interface
        l - GMAC 10/100/1000M Ethernet Controller
        l - SPI Controller
        l - UART Controller
        l - I2C controller
        l - GPIO
        l - USB OTG3.0
        18、USB 2.0 Host
        19、PCIe
        20、 Others
        l - Temperature Sensor(TS-ADC)
        -SAR-ADC(Successive Approximation Register)
        l - eFuse
        l - Package Type
        n BGA316 (body: 14mm x 14mm ; ball size : 0.3mm ; ball pitch : 0.65mm)
         
        RK3399’s Block Diagram
        RK3399's Block Diagram  
        RK3399’s Package
        RK3399's Package
        RK3399's Package
        RK3399’s Ordering Information

        RK3399's Ordering Information

        RK3399's Ordering Information

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